The Critical Link: Advancing Designs with High-Density Board-to-Board Connectors

The 5G era demands increasingly sophisticated board-to-board connector solutions that combine secure connections,high-speed transmission,and strong interference resistance.These critical electronic components must achieve ultra-low profiles,miniaturization,and precision engineering while maintaining robust performance across diverse applications.

Selection Criteria&Performance Parameters:

-Key Specifications:Pin count,pitch values,and stacking height serve as fundamental selection criteria for these electronic connector systems

-Electrical Performance:Contact resistance,insulation resistance,current rating,and dielectric strength define crucial operational parameters

-Environmental Durability:Temperature/humidity resistance,salt spray tolerance,and thermal shock capability ensure reliability

-Mechanical Properties:Mating force and mechanical endurance guarantee long-term connection integrity