Wafer XH2.5 Pin header 180-degree DIP

Engineered for direct insertion into printed circuit boards,the YZTECH XH2.5 Single Row Wafer Pin Header provides a robust and efficient interconnection solution.Its standardized DIN-compatible 180-degree straight pin configuration ensures seamless compatibility within diverse electronic assemblies demanding board-to-board or board-to-wire links.The rectangular housing design facilitates straightforward mating and contributes to space-efficient layouts in industrial controls,power supplies,telecommunications gear,and consumer electronics applications worldwide.

 

Precision-crafted contacts utilize high-conductivity Phosphor Bronze,plated with a reliable tin coating for superior solderability and stable low-resistance electrical paths,rated confidently at 3A 250V.The insulating colloidal body is constructed from high-grade PA66 thermoplastic,renowned for its excellent mechanical strength,resistance to creep,and flame-retardant properties.This material synergy guarantees stable signal integrity and robust physical endurance even under demanding operating conditions,ensuring dependable circuit continuity.

 

Built to withstand challenging environments,this Wafer Housing Terminal operates reliably across a broad temperature spectrum from-25°C to+85°C.Supplied in protective tray packaging,the components arrive safeguarded against damage and contamination,ready for automated pick-and-place processes or manual assembly.This combination of precision engineering,premium materials ,and reliable performance makes the YZTECH XH2.5 wafer pin header connector an essential,trustworthy component for mission-critical global electronic connector manufacturing.