Wafer MLX3.0 Pin header Male Shell Connector

The YZTECH Wafer MLX3.0 series introduces a 180-degree DIP male header,delivering reliable power delivery for PCB-based interconnection tasks that require up to 7A with 600V rating.Its 3.00mm contact spacing gives designers a harmonious balance between dense packaging and dependable mating integrity,while the dual-row arrangement equips the Connector with 6 pins,allocating three positions per row to accommodate varied board-level routing needs.The straight insertion method streamlines through-hole assembly,which aligns well with high-volume soldering processes.This product could be found in the Wafer Housing Terminal of the catalog.

The contact system starts with high-grade copper as the base conductor closely followed by a uniform tin-plated overlayer,which supports favorable solderability and moderate corrosion resistance throughout the equipment's service life.The insulating collar is molded from PA66,a glass-reinforced thermoplastic that exhibits excellent electrical isolation,maintains its dimensional stability under heat,and contributes to the rated temperature window.Its rectangular shape aids visual alignment during board placement,while the 2x3 position layout distributes mechanical mating forces evenly,decreasing the risk of pin damage during blind or angled insertion.The dual-row pattern also improves creepage distances between neighboring contacts,supplementing the 600V rating.Because the component arrives sorted in protective bag-and-box packaging,assembly lines benefit from reduced handling time and lower risk of loose parts contamination.The through-hole termination style,reinforced by the straight 180° orientation,yields robust solder fillets that reliably anchor the header to the PCB across a wide range of wave and reflow soldering profiles.