SH1.0mm Wafer Right Angle SMT Pin header

SH1.0mm Wafer Right Angle SMT Pin header

Name: SH1.0mm Pitch Wafer Right Angle SMT Pin header Connector 2P
Uploaded: 2025-10-24T07:10:05+08:00
Description: Meet the SH1.0mm wafer right-angle SMT pin header-YZTECH's advanced solution for today's space-constrained PCB

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Min. Order:	1000 Piece/Pieces
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Model No.: A10001-02AWB

Brand: YZTECH

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SH1.0mm Pitch Wafer Right Angle SMT Pin header Connector 2P

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Product Description

Meet the SH1.0mm wafer right-angle SMT Pin Header-YZTECH's advanced solution for today's space-constrained PCB designs.This innovative 2-position header connector features an ultra-compact profile with horizontal mounting capability,enabling efficient parallel board connections where every millimeter counts.The precision-crafted phosphor bronze contacts with reliable tin plating ensure stable performance under 1A/125V operating conditions.What truly sets this Connector apart is its LCP insulation material,chosen for exceptional thermal stability and moisture resistance,guaranteeing consistent performance even in demanding applications.

The SH1.0mm header brings manufacturing advantages that production engineers will appreciate.Its LCP housing maintains perfect dimensional stability through reflow soldering processes, while the tin-plated phosphor bronze contacts offer both durability and excellent solderability.Operating comfortably from -25℃ to 85℃,this connectorwafer housing terminal arrives in reel packaging ready for automated assembly-helping reduce production time and minimize installation errors.The right-angle SMT design not only saves valuable board space but also simplifies the manufacturing process,making it an ideal choice for high-volume production environments.

From wearable devices to smart home systems,medical monitors to IoT sensors,the SH1.0mm right-angle header enables innovation across multiple sectors. Its miniature footprint allows designers to create sleeker,more compact products without compromising reliability.The connector's robust construction ensures long-term performance in portable and embedded applications where space optimization is crucial.