0.8mm Pitch Board to Board Connector Male

YZTECH has introduced a pioneering 60-position dual row male board-to-board connector featuring a 0.8mm ultra-fine pitch, signifying the forefront of high-density board-to-board interconnection technology. This vertical mount solution incorporates precision-engineered contacts within an advanced LCP (Liquid Crystal Polymer) material, which offers exceptional thermal stability and insulation characteristics. The innovative design ensures dependable PCB stacking and optimal space utilization, rendering this board to borad connector smt particularly suitable for sophisticated computing systems, telecommunications infrastructure, and miniaturized electronic devices where maximum signal density and minimal footprint are paramount.

 

The 0.8mm Board-to-Board Connectors sustains a current capacity of 0.75A per contact while exhibiting superior performance in high-speed signal applications. The LCP housing material guarantees exceptional thermal resistance and mechanical robustness, ensuring reliable operation across diverse environmental conditions. The vertical mount configuration promotes efficient board-to-board interconnection while preserving precise alignment between mated PCBs. This solution supports automated assembly processes and ensures consistent mating performance in high-volume manufacturing environments.

 

Supplied in reel packaging to facilitate streamlined automated production, this Board-board connector epitomizes YZTECH's dedication to advanced interconnection technology. UL certified for safety and reliability, the flexible board to board connector represents a significant advancement in high-density design, offering exceptional value for applications necessitating ultra-fine pitch solutions, reliable signal transmission, and compact inter-board spacing in next-generation electronic systems.