yztech’s 1.27mm Pitch Heighten Type
box header SMT is a professional solution designed for high-density electronic devices with special height requirements. As an innovative model in the
smt box header category, its standard 1.27mm pitch and heightened design precisely meet the differentiated installation needs of PCB boards in three-dimensional spaces, standing out in the
1.27 mm box header field for its unique structural advantages and process compatibility.
Featuring phosphor bronze terminals (gold plating thickness ≥50u") and high-temperature-resistant PBT (UL94V-0) housings, the connector enables automated soldering via SMT technology, stably transmitting signals in -40°C to +105°C environments with contact resistance ≤20mΩ. The heightened terminal structure supports three-dimensional cross-wiring with
Right Angle Box Header, optimizing space utilization while avoiding signal interference. The 20-60 PIN modular configuration is compatible with diverse connection needs of
idc box header connector, widely used in AI motherboards, industrial robot control modules, etc. Certified to IPC-A-610 and RoHS-compliant, anti-static carrier tape packaging supports customized height services, providing idc
Box Header Connector-level solutions with both reliability and flexibility for special application scenarios of box header.