1.25 Ultra-thin Wafer SMT Pin header

Name: 1.25 Ultra-thin Wafer Horizontal SMT Pin header Connector
Uploaded: 2025-08-15T06:46:20+08:00
Description: YZTECH 1.25mm Ultra-Thin Wafer SMT Pin Header Connector is a compact, high-performance interconnection solution

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Min. Order:	1000 Piece/Pieces
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Model No.: A12501-02AWB

Brand: YZTECH

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1.25 Ultra-thin Wafer Horizontal SMT Pin header Connector

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Product Description

YZTECH 1.25mm Ultra-Thin Wafer SMT pin header connector is a compact, high-performance interconnection solution designed for modern PCB applications. Featuring a single-row, 2-pin-per-row configuration with a rectangular male interface, this wafer header connector ensures reliable signal transmission and space efficiency. Constructed with phosphor bronze contacts and gold plating, it offers excellent conductivity and corrosion resistance. The housing made of PA9T material provides high heat resistance and durability, operating reliably in temperatures from -25°C to +85°C. Its ultra-low profile and reel packaging make it ideal for automated SMT processes, ensuring streamlined production and consistent quality.

This wafer Pin Header is widely used in high-density electronic devices where space optimization and signal integrity are critical. It is commonly integrated into consumer electronics, industrial control systems, medical equipment, and communication devices such as routers, sensors, and compact wearables. The SMT design allows for direct mounting onto PCBs, reducing manual assembly efforts and enhancing production efficiency. Its stable performance under varying temperatures makes it suitable for applications in challenging environments, including automotive electronics and outdoor monitoring systems.

YZTECH’s 1.25mm wafer pin header meets international standards, including DIN specifications, ensuring broad compatibility and global market suitability. It serves industries such as telecommunications, automotive manufacturing, industrial automation, and smart technology. With its reel packaging supporting high-volume PCB assembly, this component is a preferred choice for manufacturers seeking precision, scalability, and cost-effectiveness. Its robust design and adaptability make it a future-proof solution for next-generation electronic products.