1.0mm Wafer Vertical SMT Type Pin header

YZTECH introduces its 1.0mm Wafer Vertical SMT Type pin header connector LCP 6P, a compact powerhouse engineered for next-generation PCB applications. This single-row DIN connector redefines vertical mounting efficiency with its space-saving rectangular form factor and robust brass contact system.Its vertical orientation optimizes board-to-board or board-to-component connections, reducing footprint constraints without compromising signal integrity.

 

At the heart of this wafer Pin Header lies a precision-engineered brass contact system,offering superior conductivity and mechanical durability compared to traditional phosphor bronze.The LCP colloidal material provides flame resistance and dimensional stability up to 130°C,outperforming standard plastics in harsh operating conditions.Each pin is meticulously coated with tin plating for consistent electrical performance across 1.5A/150V ratings, ensuring reliable power and signal transmission in demanding applications.The vertical SMT design features precise solder pad alignment for automated pick-and-place equipment,while the male gender configuration guarantees secure mating with female sockets.

 

Reel packaging reduces shipping costs and protects against ESD damage during transit, aligning with global trade regulations.The header connector’s universal compatibility with SMT assembly lines ensures cost-effective production scalability for OEMs worldwide.By eliminating proprietary terminologies and focusing on standardized specifications, this product detail empowers multilingual procurement teams to make informed decisions.Its thermal tolerance up to 130°C and 150V rating positions it as a premium solution for high-power applications in renewable energy systems, LED lighting, and industrial automation.