1.27mm Pin header Single Row Straight 5P
Get Latest Price| Incoterm: | Express Delivery |
| Min. Order: | 1000 Piece/Pieces |
| Transportation: | Ocean,Land,Air,Express,Others |
| Port: | Shenzhen |
| Incoterm: | Express Delivery |
| Min. Order: | 1000 Piece/Pieces |
| Transportation: | Ocean,Land,Air,Express,Others |
| Port: | Shenzhen |
Model No.: 1101.1S-1*5P-H3,0
Brand: YZTECH
Origin: China
Certification: ISO9001:2015
Species: Headers And Pcb Receptacles
Package: Other
Supply Type: Original Manufacturer
Place Of Origin: China
| Selling Units | : | Piece/Pieces |
| Package Type | : | Bag&Box Packaging |
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The YZTECH 1.27mm pitch single row pin header connector delivers reliable board-to-board and wire-to-board interconnection in a space-saving rectangular profile.This male straight insertion header features a 1*5P configuration with a 3.0mm insulator height,engineered specifically for through-hole PCB mounting applications where board real estate is at a premium.You could find it in the 1.27mm Pin Header of the catalog.
The YZTECH 1.27mm single row Pin Header is built around a brass contact base with a half-gold tin plating finish,strategically balancing cost-effectiveness and reliable signal transmission.Compliant with DIN standards and UL certified for North American market acceptance,the header connector carries a rated current of 2A and a rated voltage of 300V,comfortably supporting both signal and low-power applications.The PA6T housing exhibits exceptional heat resistance,withstanding maximum welding temperatures of 260℃ for up to 10 seconds without deformation,a critical characteristic for compatibility with lead-free reflow soldering processes.The operating temperature range spans from -45℃ to +105℃,accommodating deployment in outdoor equipment,automotive electronics,and industrial automation systems subjected to extreme thermal cycling.The straight through-hole mounting configuration provides robust mechanical anchorage to the PCB,with the 3.0mm insulator height offering adequate clearance for component placement on densely populated boards.Packaging options include bag and box formats,ensuring component protection during shipping and manageable inventory handling for both prototyping and mass production.



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