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WAFER PH2.0 Pin header Connector 15P
WAFER PH2.0 Pin header Connector 15P
WAFER PH2.0 Pin header Connector 15P
WAFER PH2.0 Pin header Connector 15P
WAFER PH2.0 Pin header Connector 15P
WAFER PH2.0 Pin header Connector 15P
WAFER PH2.0 Pin header Connector 15P
WAFER PH2.0 Pin header Connector 15P

WAFER PH2.0 Pin header Connector 15P

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Product Attributes

Model No.WAFER PH2.0 180 Degree DIP PC3.1 15P

SpeciesContact Connector

PackageBulk

Supply TypeOriginal Manufacturer

Place Of OriginChina

Packaging & Delivery

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WAFER PH2.0 Pin Socket White Connector Straight DIP With Kinked Pin 15P
Product Description
Engineered for precision and durability, the YZTECH WAFER PH2.0 180° DIP PC3.1 15P male header connector redefines reliability in PCB integration. Crafted with copper contacts and tin-plated coatings, it ensures optimal conductivity with minimal signal loss, supporting a 1A rated current and 250V voltage for robust power delivery. The PA66 colloidal material guarantees flame resistance and thermal stability across an operating range of -25°C to +85°C, making it suitable for industrial, automotive, and consumer electronics. Its straight-plug installation method simplifies assembly while maintaining secure connections, and bag packaging ensures safe transit and storage.
 
This wafer pin header connector stands out with its 180° DIP orientation, enabling seamless PCB mounting without compromising signal integrity. The PH2.0 pitch ensures compatibility with standardized PCB layouts, while the male gender design facilitates reliable mating with female counterparts. The tin-plated contacts resist corrosion and wear, extending the product’s lifespan in high-cycle applications. With a focus on safety, the PA66 housing complies with UL94 V-0 flammability standards, reducing fire risks in demanding environments. Its wide temperature tolerance and 250V rating make it versatile for both low-voltage IoT devices and high-power industrial systems.
 
Tailored for global trade, this YZTECH wafer Pin Header adheres to international standards, ensuring hassle-free cross-border compliance. Its eco-friendly PA66 material is recyclable, aligning with global sustainability trends. The bag packaging minimizes waste while protecting against dust and moisture during shipping. Each detail—from the 15P configuration to the 180° DIP design—is crafted to meet the exacting demands of modern electronics, positioning this product as a top choice for engineers and manufacturers worldwide.
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