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1.0mm Simplified Box Header

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  • 0.4mm pitch dual rows smt type connector

    0.4mm pitch dual rows smt type connector

    Min. Order:1

    Model No:052948

    yztech’s meticulously developed 0.4mm pitch dual rows smt type connector is the ideal solution for the connection needs of high-density and miniaturized electronic devices. As a member of the box header family, its precise 0.4mm pitch and dual-row...

1.0mm Simplified Box Header
The 1.0mm Simplified Box Header is a cutting - edge electronic connection solution designed for high - density circuit layouts. With its ultra - narrow 1.0mm pitch, it enables a significant increase in connection density, making it an ideal choice for miniaturized electronic devices. The simplified box - shaped structure not only reduces the overall size but also ensures reliable mechanical protection for the pins. Made from high - quality copper alloy pins and durable LCP (Liquid Crystal Polymer) housing, it offers excellent electrical conductivity and high - temperature resistance.
Product Features
Compact and minimalist structure
Simplified box - shaped design reduces the overall volume by 30%, making it suitable for ultra - thin and compact electronic product designs.
Excellent conductivity performance
High - purity copper alloy pins with a thick gold - palladium plating layer ensure low contact resistance (less than 12mΩ) and stable signal transmission.
High temperature and corrosion resistance
The LCP housing has a high melting point of 340℃ and excellent chemical resistance, enabling the header to operate stably in high - temperature and corrosive environments.
Application of environmentally friendly materials
All materials comply with RoHS 3.0 and REACH regulations, ensuring environmental friendliness and safety in all applications.
Product Philosophy
Please listen to us
Our product philosophy for 1.0mm Simplified Box Header is "Miniaturization, Maximization". This concept embodies our pursuit of creating connection solutions that break through size limitations while maximizing performance. We believe that in the era of miniaturized electronics, a compact and high - performance connection is the key to unlocking more possibilities for product innovation. By constantly exploring new materials, optimizing designs, and improving manufacturing processes, we aim to provide customers with connection products that are not only small in size but also excellent in performance, driving the development of the electronics industry towards greater miniaturization and intelligence.
Original concept
FAQ
How to prevent solder bridging during the soldering of 1.0mm Simplified Box Header?
Use a high - precision pick - and - place machine to ensure accurate placement of the header, and control the solder paste printing thickness between 0.1 - 0.12mm. During soldering, use nitrogen - protected reflow soldering and precisely control the temperature curve, with the peak temperature controlled at 265℃ - 275℃ to effectively reduce solder bridging.
Can the surface of the header be customized with markings?
Customization is available. Laser engraving or screen printing is supported, and information such as brand logos and model specifications can be printed. Please provide clear design files and customization quantity requirements.
What should I do if the mating connector cannot be inserted properly?
Check whether the pins of the header are bent, oxidized, or blocked by foreign objects. Observe with a magnifying glass and carefully correct the bent pins. Clean the oxide on the pin surface to ensure the connection part is clean and free of impurities.
Can the stack height of the header be customized?
Customization is available. We can provide customized stack heights within the range of 3.0mm - 10.0mm according to customer requirements. Please provide specific size requirements and application scenario descriptions.
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